Custom Solutions to Meet Your Design Needs
Quik-Pak provides IC packaging, advanced assembly and prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The company offers packaging and assembly services in 24 hours or less.
The company specializes in Open Cavity Plastic Packages (OCPP) and offers a limitless array of them with no minimum quantity. Packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, laser micromachining, detector array processing, remolding and marking/branding. Custom assembly services are also offered for ceramic packages, chip-on-board, stacked die, MEMS, etc. Quik-Pak's unique offerings deliver faster time to market and reduced prototype costs for new devices, while providing excellent flexibility, quality and customer service.
Wafer Processing
Quik-Pak delivers a complete menu of services for wafers up to 300mm.- Backgrinding and thinning
- Dicing of silicon, glass, quartz, laminate, ceramic, and panels
- Dicing of multi project wafers (MPW), pizza wafers and reticles
- Die sort or pick & place
- Inspection to MIL STD 883G
- Individual die thinning
Assembly Service
Quik-Pak delivers complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding, Marking/Branding and BGA sphere attach. The company processes orders from a single part to thousands, and easily accommodates multiple variations within a single build. Standard turn time for assembly services is 3 business days, but expedited turn times of 2 days, day and even 8 hours are available for when your project timeline dictates.
IC Packaging
Quik-Pak provides virtually any package you need for your prototype devices, whether Open Cavity Plastic Packages (OCPP), Open-molded Plastic Package (OmPP)™ Air Cavity QFN, ceramic, laminate substrates and even custom package configurations.- IC Prototypes in any plastic package
- Packages mechanically and electrically identical to production parts
- Unlimited package configurations
- Turnaround in 24 hours or less
Flip Chip and Advanced Assembly
The unique assembly requirements for Flip Chip, Chip-on-Board, Stacked Die, Multi-Chip Modules, System-in-Package, BGA and MEMS devices are addressed by Quik-Pak’s flexible processes and equipment, delivering prototypes to specification and on schedule.
Laser Micromachining
Quik-Pak offers unparalleled accuracy for all your micromachining needs. Our highly skilled technicians and advanced laser processing systemcan create very clean microstructures with sharply defined edges, steep walls and unprecedented precision in just about any material.
Radiation Detector Fabrication
Quik-Pak delivers custom design and fabrication of radiation sensors for incorporation into products for diverse applications,including medical imaging, homeland security, astrophysics and remote wireless monitoring. Cadmium Zinc Telluride (CZT) crystals, as well as Mercury Iodide (HgI), Mercury Telluride (HgTe) and Cadmium Telluride (CT), are cut, polished and shaped to meet specific design parameters. They are then enhanced with a low temperature solderable metallization and a proprietary coating which limits further oxidation, thereby reducing edge pixel leakage current.
Contact Info
Quik-Pak
A Division of Delphon Industries
10987 Via Frontera
San Diego, CA 92127
T: 858.674.4676
F: 858.674.4681
www.icproto.com
